「Liquid Cooling Module」

Liquid cooling is better than traditional air cooling for high-performance computing(HPC) like AI servers because it's more efficient at handling heat. Compared to air-cooled servers that require fans for heat dissipation, removing the fan modules and adopting a heat flow design can significantly increase the density of CPU and GPU. This allows for more computational power within limited space, reducing energy consumption, which in turn indicates better Power Usage Effectiveness (PUE).It also helps protect server products from exceeding specified Thermal Design Power (TDP), enhancing server reliability, availability, and even improving chip computational efficiency.

Liquid cooling utilizes liquid as a heat conduction mechanism for heat dissipation. There are two common types of liquid cooling technologies for servers on the market: direct liquid cooling and immersion cooling. These categories can be further divided into single-phase immersion cooling and two-phase immersion cooling.

Direct liquid cooling assists servers in dissipating heat by surrounding key components inside the server with sealed pipelines filled with coolant (also known as closed-loop cooling systems). Heat from the components is conducted to the coolant via heat-conductive copper plates. Subsequently, the coolant flows out of the server along the pipelines, dissipates heat through heat exchangers, and eventually returns to the server for further use.